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Electrostatic Chucks

Leveraging proprietary coating technologies and innovative manufacturing capabilities, our electrostatic chucks offer a very flat clamped wafer surface, uniform thermal properties, improved gas-cooling, superior plasma erosion resistance and ultra-low particle and metal generation. These advanced wafer contact surfaces are made of materials with tailorable electrical properties, have an optimal wafer contact area that improves overall performance and lifetime while minimizing contamination.      

  • Low particle and metal generation
  • Fast clamping and de-clamping
  • Reliable wafer clamping consistency
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