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Epic™ CMP Pads

Thermoplastic polishing pads that offer the optimal balance of best-in-class performance, quality, and cost of ownership in 150 mm, 200 mm, and 300 mm applications.

  • Thermoplastic technology provides high toughness, enabling longer pad life
  • Wide range of hardness and porosity options enable customizations for all nodes and applications in integrated circuit (IC) chemical mechanical planarization (CMP) manufacturing to improve desired key performance parameters and pad life
  • Chemically inert materials of construction provide broad compatibility with a full range of IC slurry products
  • Read More Read Less
Interested in Epic™ CMP Pads?

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